Blind and Buried Vias PCB PCBA Circuits Board

Structure: Multilayer Rigid PCB
Dielectric: FR-4
Material: Polyester Glass Fiber Mat Laminate
Application: Consumer Electronics
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil

Products Details

  • Overview
  • Company Profile
  • Our Advantages
Overview

Basic Info.

Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Organic Resin
Surface Treatment
Enig
Raw Material Supplier
Shengyi, Isola
Thick Hard Gold Plating
Available
PCB Layout
Available
Transport Package
Vacuun Packing
Specification
650*1200mm
Trademark
ZINPON
Origin
China
HS Code
85340090
Production Capacity
1000000 PCS Per Month

Product Description

Company Profile

Shenzhen ZINPON Electronics Co., Ltd

One-Stop Services Of Custom PCB Manufacturing,PCB Assembly and Electronic Components Sourcing 

Blind and Buried Vias PCB PCBA Circuits Board
PCB Manufacture
From prototype circuit boards to massproduction,from fast turn to stardard deliverytime, ZINPON is your reliable PCB manufactuer,what's more, each process from material incoming, drilling, etching, copper plating.soldermask, silkscreen, surface finished,CNC,E-testing to FQC are in house, which is very strictly under our control.
Blind and Buried Vias PCB PCBA Circuits Board
Blind and Buried Vias PCB PCBA Circuits Board
Our Advantages

 


Blind and Buried Vias PCB PCBA Circuits Board

PCB Assembly
Electronic PCB assembly is the process of populating or stuffing printed circuit boards(PCBs) with electronic surface mount and/or through-hole components to form afunctional printed circuit board assembly (PCBA).The PCB main function is to mechanically supportand electrically connect the electroniccomponents. ZINPON is your best partner.
Blind and Buried Vias PCB PCBA Circuits Board
Electronic Components Sourcing
ZINPON has its own components warehouse and has built one platform with the reach, flexibility,and support services,our custom supply chain optimization solution positions you to solve electronic component sourcing and obsolescence problems in the short term and the future.Blind and Buried Vias PCB PCBA Circuits Board

18 years experience
Accept Stardard: IPC Ill, Defence, Automotive,Medcial, We offer you expanded PCB capabilities: Rigid PCB, Flexible, Rigid-flex, HDI board
Up to 50 layer prototype PCB
ZINPON Manufacture PCB board up to 50 Layer, Raw material: Fr4, Rogers, Arlon,Panasonic,Taconic, Nelco, Isola, Ceramic, Metal core
Up to 28 layer mass production
Support PCB surface process: HASL-LF, ENIG ,Plating gold, Immersion tin, Immersion silver,ENIPIG, OSP

Fast Response services
Layers QTA Mass production
2 Layers 24 Hours 10 days
4 Layers 48 Hours 12 days
6 Layers 48 Hours 14 days
8 Layers 72 Hours 15 days
10 Layers 96 Hours 18 days
12 Layers 120 Hours 18 days
14 Layers 120 Hours 20 days
Above 16 Layers Depends on the specific requirments
Note:
-Above lead time base on EQ clearly and materail available.
-Above lead time base on general techologies.Specail requirments will need extended days.
 

 

Blind and Buried Vias PCB PCBA Circuits Board             

 

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