Key HDI Benefits

Via in Pad Process

Via Fill Types

There are many different types of via fill material: non conductive epoxy, conductive epoxy, copper filled, silver filled and electrochemical plating. These all result in a via buried within a flat land that will completely solders as normal lands. Vias and microvias are drilled, blind or buried, filled then plated and hidden beneath SMT lands. Processing vias of this type requires special equipment and is time consuming. The multiple drill cycles and controlled depth drilling adds to process time.

Cost Effective HDI

Building Non-Conventional HDI Boards

Laser Drill Technology

Drilling the smallest of micro-vias allows for more technology on the board's surface. Using a beam of light 20 microns (1 Mil) in diameter, this high influence beam can cut through metal and glass creating the tiny via hole. New products exist such as uniform glass materials that are a low loss laminate and low dielectric constant. These materials have higher heat resistance for lead free assembly and allow for the smaller holes to be used.

The application of dry resist to the laminate still uses heated roll method to apply the resist to core material. This older technology process, it is now recommended to preheat the material to a desired temperature prior to the lamination process for HDI printed circuit boards.

The preheating of the material allows for better a steady application of the dry resist to the surface of the laminate, pulling less heat away from the hot rolls and allowing for consistent stable exit temperatures of the laminated product. Consistent entrance and exit temperatures lead to less air entrapment beneath the film; this is critical to the reproduction of fine lines and spacing.

LDI & Contact Imagery

Products such as cameras, laptops, scanners and cell phones will continue to push technology to smaller and lighter requirements for the consumer's daily use. In 1992, the average cell phone weighed 220-250 grams and was strictly for making phone calls; we now call, text, surf the net, play our favorite songs or games and take pictures and videos on one tiny device weighing 151grams. Our changing culture will continue to drive HDI technology and Epec will be here to continue to support our customer needs.

1. Material: FR4 is a type of fiberglass-reinforced epoxy laminate material that is widely used for PCBs. HDI, on the other hand, is a high-density interconnect PCB technology that uses advanced materials and processes to achieve higher circuit densities and performance.
2. Layer count: FR4 PCBs typically have a lower layer count than HDI PCBs, which can have many more layers due to their increased density and complexity.
3. Trace width and spacing: HDI PCBs can support much smaller trace widths and spacing than FR4 PCBs, which allows for more efficient use of board space and higher circuit densities.
4. Via technology: HDI PCBs use advanced via technologies such as microvias, buried vias, and blind vias, which allow for more efficient routing and interconnectivity between layers. FR4 PCBs, on the other hand, typically use through-hole vias, which can limit their density and performance.
5. Cost: HDI PCBs are generally more expensive than FR4 PCBs due to their advanced materials, processes, and increased complexity.

In summary, FR4 PCBs are a widely used and cost-effective option for many electronic applications, while HDI PCBs are a more advanced and complex technology that is typically used in high-performance and high-density applications. The choice between the two will depend on the specific needs of the application, as well as the budget and design constraints.

Shenzhen Jinxiong Electronics Co., Ltd. is a Chinese professional PCB and assembly manufacturer .As one-turnkey PCB and assembly provider, we specialize in PCB fabrication, PCB assembly and components sourcing services.

Professional PCB electronics manufacture services , such as Multi-layer PCB,HDI PCB,MC PCB, ,Rigid Flex PCB,Flex PCB.We can fabricate Laser holes ,Impedance Control PCB, Buried & Blind Holes PCB, Countersunk hole , other special material or special process PCBs.

We take care of the entire process, including manufacturing of Printed Circuit Boards, procurement of components (100% original) , PCBA Testing , continuous monitoring of quality and final assembly.About testing,we provide SPI Inspection, AOI Inspection, X-ray Inspection, ICT Testing and Functional Testing as our value-added services.

Stencil manufacturing techniques include chemical etching, laser cutting and electroforming. we provide the Magnetic stencil, frame SMT stencils and Frameless SMT stencil , the stencil size and thickness can be according to client requirements. Special size and thickness can be consulting.

Q1:Are you a factory or trade company?
A: KXPCBA is a PCB/FPC/PCBA manufacturer/factory. We pecialized in PCB/PCBA Board for 11 years. 

Q2:Is my PCB file safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB for someone else without  your permission. NDA is acceptable.

Q3:What is your testing policy and how you control the quality?
A:  For sample, usually tested by flying probe; for PCB Volume over 3 square meters, usually tested by fixture, this will be more faster. Due to there's many steps to PCB production, we usually do inspection after every step.

Q4: What's your shipping way ?
A: 1. We have our own forwarder to ship goods by DHL, UPS, FEDEX, TNT,EMS. 
    2. If you have your own forwarder, we can cooperate with them.

Q5: What is your certificate?
A:  ISO9001:2008, ISO14001: 2004, UL, SGS report.

Q6: What files should we offer?
A:  If only need PCB, please provide Gerber File and manufacturing specifications; If need PCBA,Please provide Gerber File, Manufacturing specification, BOM list and Pick & Place/XY file.