Basic Info.
Model NO.
MDAWB-LS702S
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Trademark
minder-hightech
Origin
China
Product Description
Ultrasonic Wire Bonder
for Battery Connections and Power Modules
Applications
Specifications
We have 16 years of experience in equipment ,
and can provide you with a one-stop IC Package Line Equipment solution
for Battery Connections and Power Modules
Applications
Stable bonding force control improves bonding quality and reliability
Programmable ultrasound power at different stages
Real time bond wire length detection
Online monitoring and management, remote control and software upgrade
Specifications
| No. | Description | Parameter |
| 1 | Work area | X axis:300mm/1um Y axis:300mm/1um Z axis:50mm/1um T axis: +/-360 degree/0.01 degree |
| 2 | Wire size | 5mil-20mil(125um~500um) |
| 3 | Ribbon wire | 20*4 mil to 80*10mil |
| 4 | Wire Cutter | Front/Rear Cut |
| 5 | Wire feed system | Motorized with High Resolution Encoder Feedback |
| 6 | Wire loss detection | Encoder and Bond Power Detection Method |
| 7 | Maximum Wire Length | Realtime Monitoring |
| 8 | Max.loop height | Programmeable |
| 9 | Min.loop height | Programmeable |
| 10 | Bond Force | Aluminum wire:50g-1500g Ribbon wire:100g-3500g Copper wire: 100g-5000g |
| 11 | Ultrasonic Transducer | 60KHz or 80KHz |
| 12 | Ultrasonic generator | 60KHz or 80KHz@30W~100W |
| 13 | Wire cycle | 1 s |
| 14 | Power | AC220V, 50Hz, 2000W |
| 15 | Dimension | 960mm(W)x1400mm(L)x1700mm(H) |
| 16 | weight | 900kg |
We have 16 years of experience in equipment ,
and can provide you with a one-stop IC Package Line Equipment solution
